Through Hole | Chip on Board | Surface Mount (SMT) | Inspection and Testing | |
---|---|---|---|---|
Automated PTH Assembly | Die attach | QFPs | SPI | |
Press fit connectors | Aluminum Wedge bonding | uBGAs | AOI | |
Wave & Selective soldering | Flip Chip | CSPs | Flying Probe | |
CCGAs | X-ray | |||
BGAs (including double sided) | ICT | |||
0201sConvection reflow w/nitrogen | BIT |